发明名称 Semiconductor chip, fabrication method, and device for fabricating a semiconductor chip
摘要 A semiconductor chip has standard cells arranged in a plurality of mutually adjacent rows. Each standard cell is connected by a plurality of tracks for connection to other elements of the semiconductor chip and/or terminals of the semiconductor chip. The power supply tracks of the standard cells of at least one row of standard cells are shortened in such a way that the tracks terminate in the region of a standard cell at the edge of the row.
申请公布号 US2003122161(A1) 申请公布日期 2003.07.03
申请号 US20020306438 申请日期 2002.11.27
申请人 SELZ MANFRED;WAGNER MICHAEL 发明人 SELZ MANFRED;WAGNER MICHAEL
分类号 G06F17/50;H01L23/528;H01L27/118;(IPC1-7):H01L27/10 主分类号 G06F17/50
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