| 发明名称 |
Accelerometer protected by caps applied at the wafer scale |
| 摘要 |
An accelerometer chip (202) has a molded thermoplastic cap (210) applied on one surface to provide a cavity into which the cantilevered mass (204) of the accelerometer may move. An array of caps is applied to a wafer of accelerometer chips (202) before singulation of the wafer.
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| 申请公布号 |
US2003122227(A1) |
申请公布日期 |
2003.07.03 |
| 申请号 |
US20020129505 |
申请日期 |
2002.05.06 |
| 申请人 |
SILVERBROOK KIA |
发明人 |
SILVERBROOK KIA |
| 分类号 |
B29C35/08;B29C43/36;B81B7/00;B81C1/00;G01P1/02;G01P15/08;H01L23/02;H01L23/08;H01L23/16;H01L23/31;(IPC1-7):H01L23/02 |
主分类号 |
B29C35/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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