| 摘要 |
A high flux light emitting diode (LED) has an electrically and thermally conductive base substrate (11), a flip-chip type LED chip (16) with a transparent substrate (31, Fig. 2), and a cover substrate (17) adhered to the base substrate (11). The base substrate (11) may be made of copper, aluminium or silicon to dissipate heat efficiently from the LED chip (16). The cover substrate (17) has a centre hole with a slanted reflective sidewall, and is preferably made from a white and highly-reflective material. The LED chip (16) is disposed within the centre hole and is bonded to the base substrate (11). The base substrate (11) is divided by a middle insulating region (19) into two electrically isolated parts connected to the electrodes (12,13) of the LED chip (16). The centre hole is filled with transparent material (18) such as resin or epoxy to cover the hole and seal the diode chip (16). The LED chip (16) may be made from AlGaInP, AlGaInN or InGaN.
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