Card type semiconductor device

摘要

A card type semiconductor device which has a main circuit board (2) equipped with primary modules such as a CPU (10) and an I/O sub-system chip (13) and a first sub-circuit-board (3) equipped with a main memory (9). The main circuit board is connected to the first sub-circuit-board through an FPC (4). Further, a first TCP (5) equipped with the CPU and a second TCP (6) equipped with the I/O sub-system chip are mounted on both of the top and bottom surface of the main circuit board in such a manner that the second TCP is placed just opposite the first TCP. The card type semiconductor device is used as a card type computer by bending the FPC and facing the main circuit board to the sub-circuit-board and enclosing the main circuit board and the sub-circuit-board in a card-shaped thin housing. Thereby, reduction in size and thickness of the card type semiconductor device can be achieved. Further, a high density packaging can be realized. Moreover, an operation of the card type semiconductor device can be performed at a high speed. Furthermore, the performance of the card type semiconductor device can be easily and most appropriately changed in a short time at a low cost without changing the primary modules only by replacing the sub-circuit-board with another circuit board.