METHOD FOR ALIGNING WAFER

摘要

PURPOSE: A method for aligning a wafer is provided to align accurately a wafer and a reticle and reduce alignment errors by using the first CCD camera and the second CCD camera to compare images of the first and the second cameras to each other. CONSTITUTION: The first alignment process for a wafer is performed. The first alignment process is to detect a notching part(22) of a wafer(20) by using the first CCD camera(10). In the first alignment process, the wafer is loaded on a wafer chuck(12). The first alignment process is performed by rotating the wafer chuck. The aligned wafer is transferred to a wafer stage. The second alignment process for the aligned wafer is performed on the wafer stage by using the second CCD camera.