ANGLE AND GAP ADJUSTABLE NOZZLE APPARATUS FOR TEBR OF SEMICONDUCTOR WAFER

摘要

PURPOSE: An angle and gap adjustable nozzle apparatus for TEBR(Topside Edge Bead Removing) of semiconductor wafer is provided to be capable of actively coping with the problems generated in a process by adjusting the angle and height of a rinse solution jetting nozzle. CONSTITUTION: A bracket(30) is connected to one side of a column(23). A rotating part(40) is connected with the end portion of the bracket(30) using a hinge shaft(32). A guiding hole(33) is formed in the end portion of the bracket(30). A controlling shaft(34) is capable of fixing the rotating part(40) through the guiding hole(33). A fixing and loosing part is capable of fixing and moving a rinse solution jetting nozzle(22) at one side of the rotating part(40).