| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that a working space is small and workability is poor in a polishing apparatus for polishing surfaces of single crystal silicon wafers etc., to be used for substrates of semiconductor integrated circuits, because press cylinders located at the upper part of the apparatus for pressing workpieces arranged on a frame and also for vertical movement of the apparatus are arranged so as to overlap in the vertical direction with a plurality of plates connected to the piston rods of the cylinders and arranged at the lower part of the frame. <P>SOLUTION: The press cylinders for pressing workpieces and for vertical movement of the apparatus and the frame supporting a plurality of plates connected to the piston rods and arranged at the lower part of the frame are constructed so as to form a portal shape column. After finishing of machining operation, the portal shape column is horizontally moved from the working area of a surface plate. Consequently, the working space on the surface plate is secured and workability of the apparatus is improved. <P>COPYRIGHT: (C)2003,JPO |
