METHOD AND APPARATUS FOR POLISHING SEMICONDUCTOR WAFER

摘要

PURPOSE: A method and an apparatus for polishing a semiconductor wafer is provided to improve the polishing uniformity by swinging a polishing pad between a center portion and an edge portion of the semiconductor wafer. CONSTITUTION: An apparatus for polishing a semiconductor wafer includes a rotary shaft, a wafer holder(52), a fixing plate(60), and a polishing pad(62). The wafer holder is rotated by the rotary shaft. A wafer(2) is arranged on an upper face of the wafer holder. A material layer of the wafer is directed to an upper portion. The fixing plate is located on an upper portion of the holder in order to press the surface of the wafer. A diameter of the fixing plate is smaller than the diameter of the wafer. The polishing pad is formed at the fixing plate in order to polish the surface of the wafer.