| 摘要 |
PROBLEM TO BE SOLVED: To obtain a gate mark repairing chip in which a stringiness does not occur when the chip is separated from a sectional surface without adhering a resin to a heater in a method for repairing a gate mark of an injection molding and to obtain the method for repairing the gate mark using the same. SOLUTION: A resistance heater 20 of the gate mark repairing chip has folding parts 24, side plates 22 and a contact surface 23 in a functionally roughly divided manner. The wide folding parts 24 each has an area broadened as compared with that of other part of the heater 20, and an insulating support member 30 is mounted between the folding parts 24. The parts 24 are lowered in its resistance value by thickening the plates as compared with another part to prevent the heat from generating due to Joule heat so that the entire heater 20 is prevented from becoming a high temperature. Further, the heater 20 has an air pipe 70 for blowing cooling air to a rear surface of the heater 20. COPYRIGHT: (C)2003,JPO
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