发明名称 ARTICLE, METHOD, AND APPARATUS FOR ELECTROCHEMICAL FABRICATION
摘要 An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
申请公布号 EP1015669(A4) 申请公布日期 2003.07.02
申请号 EP19980914464 申请日期 1998.04.03
申请人 UNIVERSITY OF SOUTHERN CALIFORNIA 发明人 COHEN, ADAM, L.
分类号 B81C1/00;B21C37/00;C23F1/00;C25D;C25D1/00;C25D1/10;C25D5/02;C25D5/10;C25D7/12;C25D17/06;C25D19/00;C25D21/12;H01L21/288;H05K3/24 主分类号 B81C1/00
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