| 摘要 |
PURPOSE: A multi-chip module structure of a semiconductor device and a method for manufacturing the same are provided to be capable of reducing the size of a memory and non-memory module by stacking a plurality of CSP(Chip Scale Package) semiconductor devices on an SMT(Surface Mount Technology)-type semiconductor device, and reducing manufacturing processes by using a TAB(Tape Automated Bonding) or flip-chip bonding process. CONSTITUTION: An SMT-type semiconductor device(10) is completed with an EMC(Epoxy Molding Compound) molding process. At least one CSP semiconductor device(20) is attached on one surface or both surfaces of the SMT-type semiconductor device(10) using a TAB(Tape Automated Bonding) or flip-chip bonding process. At this time, the outer leads(14b) of the SMT-type semiconductor device(10) are electrically connected with the outer leads(22b) of at least one CSP semiconductor device(20). |
