发明名称 METHOD FOR TRANSFERRING WAFER USING TRANSFER MEANS
摘要 PURPOSE: A method for transferring a wafer using transfer means is provided to be capable of preventing the damage of wafers by sequentially loading wafers into designated slots of the second cassette corresponding to each slot of the first cassette according to the order of wafers drawn from the first cassette. CONSTITUTION: The first and second cassette are located at the first and second loadlock chamber, respectively. The one-to-one correspondence between slots of the first cassette and those of the second cassette, is designated(S1). That a wafer is drawn from one slot of the first cassette by transfer means, is recognized(S3). The wafer drawn from one slot of the first cassette is loaded into the corresponding slot of the second cassette(S5).
申请公布号 KR20030053947(A) 申请公布日期 2003.07.02
申请号 KR20010083991 申请日期 2001.12.24
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, HUI SAM
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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