| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a plasma cleaning apparatus that prevents oxidation of a copper pad, a copper frame and the like formed on a substrate, and can efficiently and equally clean both sides of the substrate. <P>SOLUTION: The plasma cleaning apparatus is provided with a power source portion 3 having a high frequency power source 31, a chamber 2 capable of closing in an airtight condition, the upper electrode 29 connected to the high frequency power source 31 and the lower electrode 28 grounded to a ground electric potential that are disposed opposite in the chamber 2 and ought to form a plasma space between each other thereof, a conductive tray 27 that is fixed with freely accessing to a horizontal direction between the upper electrode 29 and the lower electrode 28 and comes into contact with a top portion of the lower electrode 28 in an accommodated condition, a pair of projection bars 171 that is provided on the tray 27 and supports both side portions of the substrate A in order that the substrate A for subjecting to plasma cleaning at least formed with the copper frame and the copper pad is engaged in a non-contact condition in the vicinity thereof against the tray 27 and a gas supply apparatus 4 that supplies argon gas used for plasma cleaning into the chamber 2. <P>COPYRIGHT: (C)2003,JPO</p> |
