| 摘要 |
PURPOSE: A stacked package and a method for manufacturing the same are provided to be capable of easily obtaining the stacked package by using a single chip package, such as CSP(Chip Size Package) and BGA(Ball Grid Array) package. CONSTITUTION: A stacked package comprises three individual packages(10a,10b,10c) and a circuit substrate(20). Each individual package(10a,10b,10c) includes a semiconductor chip, a leadframe, a gold wire and an encapsulant. The first individual package(10a) is stacked on the upper of the circuit substrate(20), and the second and third individual package(10b,10c) are stacked on the lower of the circuit substrate(20). The circuit substrate(20) further includes the first region(20a), the second region(20b) located between the second and third individual package(10b,10c), and the third region(20c). Each individual package is bonded with the first region(20a) of the circuit substrate(20) through solder balls(24). |
