METHOD AND DEVICE FOR SOLDERING

摘要

PROBLEM TO BE SOLVED: To provide a method and a device for soldering, in order to obtain a soldering area of higher level joint quality by controlling the time period from fusing of the solder to completion of its coagulation within a certain range. SOLUTION: The method is provided with a heating means 1 heating the soldering area and a control means 2 controlling the heating means 1. The control means 2 prevents the joint interface from needless formation of more intermetallic compound layers by controlling the time from heating and fusing of the solder to completion of its coagulation within a certain range, then ensures a diffusion layer required for joint to obtain a higher level joint quality. COPYRIGHT: (C)2003,JPO