COATING METHOD AND APPARATUS FOR COATING LIQUID ONTO SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method for uniform formation of a coating film in film thickness and quality over the entire surface of a substrate by making efficient use of a coating liquid, preventing it from scattering from the face of the substrate and avoiding the coating liquid to be applied needlessly in the circumference of the substrate or the edge surface thereof.

SOLUTION: A wafer W held in a level position by a wafer stage 10 is revolved around a revolution support axis 34 within the horizontal plane, and a wafer is made to revolve around a self-rotating support axis 14 within the horizontal plane in the counter-direction to the revolution of the wafer. By changing the revolution radius of the wafer, the coating liquid is supplied from a resist supply nozzle 56 to the surface of the wafer.

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