| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a coating device which reduces the disposal amount of a coating liquid. <P>SOLUTION: An SOD system which forms an interlayer dielectric in a semiconductor wafer W has a coating unit (SCT) 11 having a coating liquid discharge nozzle 81 for applying the coating liquid to the wafer W, and a coating liquid feeder 95 for supplying the coating liquid to the coating unit (SCT) 11. The coating liquid feeder 95 has a container 10 attached with a cap 9 having a built-in filter 8 filled with the coating liquid, a holder 31 for detachable holding the container 10, a first pump 32 for sucking the coating liquid filling the container through the filter 8, a second pump 33 for sucking the coating liquid from the first pump 32 and feeding the coating liquid to a coating liquid discharge nozzle 81, circulation piping 44, 45 for returning a part of the coating liquid which exists in the first pump 32 and the second pump 33 and contains many air bubbles to the container 10. The container 10 is disposed adjacent to the first pump 32, and the coating liquid containing many air bubbles is returned to the container 10. <P>COPYRIGHT: (C)2003,JPO |
