发明名称 Equipment packages for shock resistance
摘要 The invention provides novel equipment packages, principally for portable equipment such as laptop computers, which provide decoupling, damping and shock isolation of acceleration sensitive components within the packages. Two principal embodiments are disclosed. In the flexible shell embodiment, a plurality of flexible fillers are attached to a flexible shell and a plurality of objects or components are attached to the fillers. In the flexible chassis embodiment, a plurality of objects or components are mounted to the flexible chassis to form an assembly and a plurality of flexible fillers are attached to the chassis to form the complete package. One design methodology employs a decoupled simple harmonic oscillator (SHO) model to optimize the shock response behavior. A second design methodology uses a deterministic method (finite element method) to establish the parameters for the filler and shell materials.
申请公布号 US6586058(B1) 申请公布日期 2003.07.01
申请号 US19970781299 申请日期 1997.01.13
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 ETZOLD KARL-FRIEDRICH
分类号 B65D77/26;B65D85/38;G06F1/16;G06F1/18;(IPC1-7):B65D85/30;H05K7/14 主分类号 B65D77/26
代理机构 代理人
主权项
地址