Electrical circuit board and a method for making the same

摘要

A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 which have improved solder-wetting characteristics by causing a first insulating layer to separate from a portion of a first conductive layer of the multi-layer electronic circuit board 10 which allows for communication by and between some or all of the various component containing surfaces, and portions of the formed multi-layer electrical circuit board 10, which selectively allows components contained within and/or upon these portions and surfaces to be interconnected.