| 发明名称 |
Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder |
| 摘要 |
A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided.
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| 申请公布号 |
US6585150(B1) |
申请公布日期 |
2003.07.01 |
| 申请号 |
US20000687524 |
申请日期 |
2000.10.12 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BERNIER WILLIAM E.;HENDERSON DONALD W.;SPALIK JAMES;PAQUIN ISABELLE |
| 分类号 |
B23K35/22;C23C8/00;C23C26/00;H01L21/60;H05K3/28;H05K3/34;(IPC1-7):B23K31/02 |
主分类号 |
B23K35/22 |
| 代理机构 |
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代理人 |
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