发明名称 |
Control of laser machining |
摘要 |
A UV laser beam is used to machine semiconductor. The beams intensity (IB) is chosen so that it lies in a range of such values for which there is an increasing (preferably linear) material removal rate for increasing IB An elongate formation such as a trough or a slot is machined in n scans laterally offset (O_centre), for each value of z-integer in the z direction.
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申请公布号 |
US6586707(B2) |
申请公布日期 |
2003.07.01 |
申请号 |
US20010984086 |
申请日期 |
2001.10.26 |
申请人 |
XSIL TECHNOLOGY LIMITED |
发明人 |
BOYLE ADRIAN;DUNNE KALI;FARSARI MARIA |
分类号 |
B23K26/00;B23K26/14;B23K26/40;B23K101/40;H01L21/301;(IPC1-7):B23K26/38 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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