发明名称 High density pixel array and laser micro-milling method for fabricating array
摘要 A pixel array device is fabricated by a laser micro-milling method under strict process control conditions. The device has an array of pixels bonded together with an adhesive filling the grooves between adjacent pixels. The array is fabricated by moving a substrate relative to a laser beam of predetermined intensity at a controlled, constant velocity along a predetermined path defining a set of grooves between adjacent pixels so that a predetermined laser flux per unit area is applied to the material, and repeating the movement for a plurality of passes of the laser beam until the grooves are ablated to a desired depth. The substrate is of an ultrasonic transducer material in one example for fabrication of a 2D ultrasonic phase array transducer. A substrate of phosphor material is used to fabricate an X-ray focal plane array detector.
申请公布号 US6586702(B2) 申请公布日期 2003.07.01
申请号 US20010780059 申请日期 2001.02.09
申请人 LASER ELECTRO OPTIC APPLICATION TECHNOLOGY COMPANY 发明人 WIENER-AVNEAR ELIEZER;MCFALL JAMES EARL
分类号 B23K26/00;B23K26/38;H04R17/00;(IPC1-7):B23K26/00 主分类号 B23K26/00
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