发明名称 |
Combination electrical power distribution and heat dissipating device |
摘要 |
In accordance with the teachings of the present invention, the electronic system comprises a housing having a base and a lid. A circuit board is installed on the base of the housing. At least one solder pad is disposed on the circuit board for receiving an electronic component. The solder pad provides both an electrical connection and a mechanical support to the electronic component. The electronic system is also provided with a devise that is capable of distributing power to the electronic component and simultaneously removing heat away from the electronic component. The device is also mounted on the solder pad and positioned adjacent to the electronic component.
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申请公布号 |
US6587346(B1) |
申请公布日期 |
2003.07.01 |
申请号 |
US20020062144 |
申请日期 |
2002.01.31 |
申请人 |
VISTEON GLOBAL TECHNOLOGIES, INC. |
发明人 |
PARKER DAVID ALAN |
分类号 |
H01L23/055;H05K1/02;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/055 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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