发明名称 |
Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head |
摘要 |
A transport system for the implementation of electrolytic deposition, coating or etching; and more particularly, an apparatus for selective electrolytic metallization and deposition utilizing a fluid head arrangement. A method is provided for making and maintaining an electrical contact with a product being processed in a transport system employed for selective electrolytic metallization and deposition, coating or etching. The method of making and maintaining an electrical contact with a product being processed may be utilizing a fluid head arrangement.
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申请公布号 |
US6585865(B2) |
申请公布日期 |
2003.07.01 |
申请号 |
US20010755853 |
申请日期 |
2001.01.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ACCIAI MICHAEL;TISDALE STEVEN L. |
分类号 |
H05K3/18;C25D5/02;C25D7/06;C25D21/00;C25D21/12;C25F7/00;H05K3/24;(IPC1-7):C25D17/00 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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