Method of bonding and transferring a material to form a semiconductor device,申请号AU20020353020-传众专利搜索

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发明名称	Method of bonding and transferring a material to form a semiconductor device
摘要
申请公布号	AU2002353020(A8)	申请公布日期	2003.06.30
申请号	AU20020353020	申请日期	2002.12.05
申请人	MOTOROLA, INC., A CORPORATION OF THE STATE OF DELAWARE	发明人	SEBASTIAN CSUTAK;ROBERT E. JONES
分类号	H01L23/538;H01L21/20;H01L21/762;(IPC1-7):H01L21/762	主分类号	H01L23/538
代理机构		代理人
主权项
地址

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