| 摘要 |
PURPOSE: An apparatus for absorbing a residual solution for a semiconductor process-chemical spray nozzle is provided to prevent drops of residual process-chemical from dripping even if a spray nozzle moves by installing a system capable of absorbing or exhausting the drops of the residual process solution in a part of the process-chemical spray nozzle. CONSTITUTION: An absorption line(101) makes an arbitrary process chemical collide with an end protrusion of a guide piece, mounted on the semiconductor process-chemical spray nozzle for spraying a process chemical to a wafer. The absorption line functions as an absorption path of the process chemical remaining in the end protrusion of the guide piece. An absorption control module makes a series of vacuum states, connected to the absorption line. The absorption control module drives to make the process chemical remaining in the end protrusion of the guide piece selectively absorbed along the absorption line. An air supply control unit(160) selectively controls the supply state of outside air according to the control of an absorption control controller(110), controlled by the absorption control controller. A vacuum connection valve(120) selectively opens according to the air supply state of the air supply control unit to make a series of vacuum states in a part of the air supply path, controlled by the absorption control controller. A process chemical storing receptacle(130) collects and temporarily stores a corresponding process chemical when the process solution remaining in the end protrusion of the guide piece through corresponding vacuum.
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