METHOD FOR MANUFACTURING CHIP SIZE PACKAGE

摘要

PURPOSE: A method for manufacturing a CSP(Chip Size Package) is provided to be capable of simplifying the manufacturing process. CONSTITUTION: Solder bumps(12) are formed on semiconductor chips(10). The first sawing is performed on a back side of a wafer(50) according to a scribe line. A heat slug is attached to the back side of the wafer. The first coating solution(50a) fills space between the semiconductor chips. The second sawing is performed from the front side of the wafer to the region filled with the first coating solution. Tap tapes(60) with circuit patterns are attached on the semiconductor chips. The second coating solution(50b) fills space between the semiconductor chips. Solder balls(70) is attached on the tap tapes. Then, the semiconductor chips are isolated to unit chip.