METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for fabricating a semiconductor device is provided to prevent a pattern defect of a photoresist layer by preventing reaction byproduct melted by developer from being attached to a semiconductor substrate. CONSTITUTION: A photoresist layer is coated on a semiconductor substrate(S1). An exposure process is performed on the photoresist layer through a photomask having a predetermined pattern(S3). Developer is sprayed on the photoresist layer while the semiconductor substrate rotates(S21). The semiconductor substrate stops rotating to make the developer rapidly penetrate into the photoresist layer. The first wet development process is performed on the photoresist layer while the semiconductor substrate is vibrated(S23). The semiconductor substrate stops rotating. The second wet development process is performed on the photoresist layer while the semiconductor substrate is stably maintained(S25). A cleaning process using deionized water is performed on the semiconductor substrate(S29).