| 摘要 |
PROBLEM TO BE SOLVED: To provide a segmentation method without risk of planes cleft askew and with a minimum degradation in productivity in a process of cleaving a semiconductor substrate into chips. SOLUTION: The method includes a step of bonding a semiconductor substrate 1, with semiconductor elements built therein, to an adhesive sheet 2; a step of creating scratches 5a, 5b in the substrate 1 in alignment with scribed lines 3 for the initiation of cleavage; a first segmentation step of separating the substrate 1 into rectangular semiconductor bars 9; and a second segmentation step of separating the bars 9 into individual semiconductor chips 10. In the first segmentation step, a metal roller 8 is pressed to and rolled on the substrate 1; in the second segmentation step, cutter blades 11 are thrust up from under the semiconductor bars 9. COPYRIGHT: (C)2003,JPO |
