| 摘要 |
PROBLEM TO BE SOLVED: To greatly enhance device reliability after packaging by efficiently removing cracks developed in wafers due to back grinding in a method and device for separating a wafer carrying a multiplicity of semiconductor devices into individual semiconductor devices. SOLUTION: The method has an etching process wherein dicing lines 7 in the circuit-carrying surface 2a of a wafer 2 are etched for the formation of half-cut trenches 3, a process wherein a back grind tape 4 is bonded to the surface 2a of the wafer 2 and mechanical grinding is at the same time accomplished for the removal of a prescribed thickness of the backside 2b of the wafer 2 with a thickness 5 retained for preventing the trenches 3 from penetration, and a process wherein etching or grinding, chemical or mechanical, is performed on the side of the backside 2b of the wafer 2 for the separation of the wafer 2 into individual semiconductor devices 12. COPYRIGHT: (C)2003,JPO |
