发明名称 POWER MODULE WITH COOLING MECHANISM AND METHOD OF COOLING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a power module which restrains a temperature distribution generated by heat generated by a power element, which cools the power element uniformly, which does not break down the power element and which is of high reliability. SOLUTION: In the power module which is composed of a plurality of power elements 1, a heat dissipating base 6, an output terminal 5 and a control terminal 4, thermoelectric modules 7 in which thermoelectric semiconductor elements 7a for thermoelectric conversion are arranged on an insulating substrate so as to be divided into a plurality of regions are attached to positions coming into close contact with, or adjacent to, rear surfaces of the power elements 1, the plurality of regions are arranged individually at the respective power elements 1, and the mounting number of the elements and/or the arrangement interval of the elements are changed in the respective regions. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003179204(A) 申请公布日期 2003.06.27
申请号 JP20010379231 申请日期 2001.12.12
申请人 YASKAWA ELECTRIC CORP 发明人 SASAKI AKIRA;HAYASHI SAEMITSU;ISHIDA YUJI
分类号 H01L23/38;H01L25/07;H01L25/18;(IPC1-7):H01L25/07 主分类号 H01L23/38
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