| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module of a constitution which surely enhances a heat dissipation effect. SOLUTION: A base substrate 22 is covered with an insulating case 24, and a wiring board 32 is extended upward along a case side face so as to be exposed on the surface of the insulating case 24. The base substrate 22 forms an angle-shaped part 34 curved at a right angle so as to come into close contact with one side face of the insulating case 24, its upper end is erected and installed to be adjacent to, and parallel to, the wiring board 32 at the inside of the insulating case 24, and a drain-electrode bus bar 25 is connected directly to the base substrate 22. The angle-shaped part 34 is formed over the whole length in the longitudinal direction of the semiconductor module. A shielding plate 35 is erected and installed between the wiring board 32 and the angle- shaped part 34. A setscrew 28 is passed through a small-diameter threaded hole in the base substrate 22 via a large outside diameter flat washer 33, and it screws and fixes the semiconductor module 1 to a heat sink 29. COPYRIGHT: (C)2003,JPO |
