| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor module which is capable of reducing a space necessary for manufacturing processes and of manufacturing a semiconductor module of a smaller size. <P>SOLUTION: A resin for insulation is molded to be integrated with electrodes or a circuit board to form a base material 11. A semiconductor device 14 is mounted on the base material 11, and then the semiconductor device 14 and the electrodes 12 on the base material 11 are wire-bonded by gold wires 15 using a wire bonding tool. After finishing the wire bonding, sealing material leakage preventing walls 16 are so formed on the base material 11 as to surround a sealing area to prevent the leakage of a gel-like sealing material when sealing the semiconductor device 14 and the bonding wires 15. Thereafter, a space surrounded by the sealing material leakage preventing walls 16 that includes the semiconductor device 14 and the bonding wires 15 is filled with a gel-like resin, and then the gel-like resin is cured to seal the semiconductor device 14 and the bonding wires 15. <P>COPYRIGHT: (C)2003,JPO |
