| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-layer circuit board for which inter-layer contact resistance between multi-layer circuits in the multi-layer circuit board is reduced and transmission characteristics of the entire circuit are improved, and the manufacturing method. SOLUTION: For a circuit board, by forming a through-hole 3 by etching with conductor foil 2 of an insulating material 1 having the conductor foil 2 forming a conductor circuit on one surface as a mask and executing side etching so as to make an opening part of the through-hole 3 of the insulating material 1 larger than the opening part of the through-hole 2b of the conductor foil 2, a contact area of the conductor foil 2 and conductive paste 4 filled inside the through-hole 3 is increased. The multi-layer circuit board using it and the manufacturing method are provided. COPYRIGHT: (C)2003,JPO |
