| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow furnace not generating fine metal powder, for which the problems of a conventional reflow furnace that the fine metal powder is generated at the time of soldering a printed board, is stuck between adjacent conducting parts of the printed board and lowers a function of an electronic appliance are solved. SOLUTION: A heat resistant non-metallic material 10 is installed to a rail 6 laid inside a tunnel of the reflow furnace, rollers 14 of a chain are brought into contact on the non-metallic material and the chain is made to travel. COPYRIGHT: (C)2003,JPO |
