发明名称 HOT PLATE UNIT
摘要 PROBLEM TO BE SOLVED: To provide a hot plate unit which can be cooled in a short time while not accompanying structural complexity and size increase. SOLUTION: This hot plate unit 1 is constituted by a hot plate 3 having a resistor 10 at an opening part 4 of a casing 2. A space S1 through which fluid can flow is constituted by the casing 2 and the hot plate 3. A seal structure 14 is arranged between the upper edge of the opening part 4 of the casing 2 and the bottom-face peripheral part of the hot plate 3. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003178964(A) 申请公布日期 2003.06.27
申请号 JP20020277937 申请日期 2002.09.24
申请人 IBIDEN CO LTD 发明人 FURUKAWA MASAKAZU;ITO YASUTAKA;SAITO YUZURU
分类号 H05B3/20;H01L21/027;H05B3/74;(IPC1-7):H01L21/027 主分类号 H05B3/20
代理机构 代理人
主权项
地址