| 摘要 |
PROBLEM TO BE SOLVED: To make a solid-state imaging device using a ceramic package with a flange thin. SOLUTION: A solid-state image sensor 5 is bonded to the surface of a second layer 2 in the ceramic package with the flange constituted of a first layer 1 which has an electroplated interconnection on its surface, the second layer 2 which has a through conductive part, a third layer 3 which partitions a space used to house the image sensor 5 by forming an inside sidewall erected from the surface of the second layer 2, which has a second through conductive part and an inner lead layer 9 and in which a cutout exists in a flange part and a fourth layer 4 which forms an inside sidewall in such a way that the space used to partition the third layer 3 is extended upward and that the inside part of the inner lead layer 9 is exposed. A transparent sealing plate 6 is bonded to the surface of the fourth layer 4. COPYRIGHT: (C)2003,JPO
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