发明名称 ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electronic component in which malfunction due to heat or the change of the operation can be prevented and which has high productivity and reliability. SOLUTION: The electronic component comprises a cover 220 made of a glass and integrally connected to a base 211 made of a silicon material, a micro- relay chip 210 assembling a movable piece 213 and coating with the cover 220, and a base 230 resin-molded so as to expose the bottom of the base 211. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003179085(A) 申请公布日期 2003.06.27
申请号 JP20020238565 申请日期 2002.08.19
申请人 OMRON CORP 发明人 SAKATA MINORU;NAKAJIMA TAKUYA;SEKI TOMONORI;FUJIWARA TERUHIKO;TAKEUCHI TSUKASA
分类号 H01L41/08;H01H11/00;H01H37/14;H01H37/52;H01H57/00;H01L21/56;H01L23/02;H01L41/09;H01L41/18;(IPC1-7):H01L21/56 主分类号 H01L41/08
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