ONE CHIP TYPE THIN FILM INDUCTOR AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: An one chip type thin film inductor and a method for manufacturing the same are provided to be capable of reducing the size and weight of a chip module package by forming an IC(Integrated Circuit) and the thin film inductor on the same semiconductor substrate. CONSTITUTION: The first and second well region(221,241) are formed in a semiconductor substrate(200). The first and second MOS(Metal Oxide Semiconductor) transistor(pMOS,nMOS) are formed on the first and second well region, respectively. A plurality of metal layer patterns(202,204) are electrically connected between the first and second MOS transistor and impurity regions(222,242). A protecting isolation layer(205) is located on the resultant structure for separating the metal layer patterns. A lower core layer pattern(262) is formed on the predetermined portion of the protecting isolation layer. The first polyimide layer(261), a metal coil layer(264), the second polyimide layer(263), an upper core layer pattern(269), and the third polyimide layer(267) are sequentially formed on the resultant structure.