发明名称 METHOD OF SOLDER APPLICATION TO STRUCTURE
摘要 FIELD: applicable in manufacture of structure consisting of tubular case and cellular member. SUBSTANCE: cellular member is formed as a package and/or rolled into coil metal sheets whose, at least, one part presents structurized one with formation of channels for passage of fluid medium. Cellular member is partially installed into tubular case. Section protruding out of case is brought into contact with adhesive composition. Cellular member is finally installed into tubular case, and solder is brought into case. EFFECT: simplified the processing of solder application, before soldering and lowered its cost. 14 cl, 6 dwg
申请公布号 RU2207233(C2) 申请公布日期 2003.06.27
申请号 RU20000121565 申请日期 1999.01.21
申请人 EHMITEK GEZEL'SHAFT FJUR EHMISSIONSTEKHNOLOGI MBKH 发明人 VIRES LUDVIG
分类号 B01D53/88;B01D53/94;B23K1/00;B23K3/06;F01N3/28;(IPC1-7):B23K1/00 主分类号 B01D53/88
代理机构 代理人
主权项
地址