发明名称 |
CONDUCTIVE BALL MOUNTING APPARATUS |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a conductive ball mounting apparatus which is capable of eliminating various defects due to a flux remaining in pins of a flux supplying apparatus. <P>SOLUTION: The conductive ball mounting apparatus comprises a positioning means for a package 10; conductive ball supplying means; alignment mask for chucking conductive balls and supplying them to the package 10; flux supplying fixture 66 which is provided with a plurality of pins 72 which are disposed in the same arrangement as a plurality of connection terminals formed in the package and which can be slid in the axis direction and supplies a flux 9 attached to the tips of the pins 72 onto the connection terminals of the package 10; and cleaning apparatus 90 for cleaning off the flux 9 attached to the tips of the pins 72 of the flux supplying fixture 66. By periodically cleaning the pins 72, defects due to the flux remaining in the pins 72 can be eliminated. <P>COPYRIGHT: (C)2003,JPO</p> |
申请公布号 |
JP2003179090(A) |
申请公布日期 |
2003.06.27 |
申请号 |
JP20010379093 |
申请日期 |
2001.12.12 |
申请人 |
HITACHI VIA MECHANICS LTD |
发明人 |
ISHIHARA KAZUAKI;NAITO YOSHITATSU |
分类号 |
B23P19/00;H01L21/60;H01L23/12;H05K3/34;(IPC1-7):H01L21/60 |
主分类号 |
B23P19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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