发明名称 PARTIAL SOLDERING SYSTEM
摘要 PROBLEM TO BE SOLVED: To solve the problems of productivity that synchronism of carrying among respective processes is degraded when a carrying speed is accelerated and manual aid is required for carrying-in and carrying-away while a printed wiring board is fixed to a carrier and carried out work is performed after positioning the printed wiring board in a flux applying process, a preliminary heating process and a soldering process in a partial soldering system for soldering an electronic component which can not be reflow-soldered due to the problem of a shape and heat resistance. SOLUTION: A carrying-in station 1, a flux applying station 2, a preliminary heating station 3, a soldering station 4 and a carrying-away station 5 are disposed straightly with almost equal intervals. The printed wiring board 10 is tact-carried by one actuator for each operation and positioned thereafter and each work in each station is performed. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003179338(A) 申请公布日期 2003.06.27
申请号 JP20010376753 申请日期 2001.12.11
申请人 NIHON DENNETSU KEIKI CO LTD 发明人 KONDO KENJI
分类号 B23K1/00;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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