IC CHIP, MOUNTING STRUCTURE OF IC CHIP, LIQUID CRYSTAL PANEL, LIQUID CRYSTAL DEVICE, AND INK JET APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a method for mounting an IC which is capable of aligning an IC and a translucent substrate easily and accurately by gauging. SOLUTION: On parts of a translucent substrate 2b which correspond to dummy bumps 7a located in corners 4a of an active face 4a of an IC chip 4, alignment marks 8 having the same shape as the contour of the dummy bumps 7a are provided. With the dummy bumps 7a and the alignment marks 8 being positionally consistent, the IC chip 4 is bonded on the translucent substrate 2b using an ACF 9. By adjusting a photographing region of a camera 11 to a corner of the IC chip 4, the dummy bumps 7a and the alignment marks 8 can be always photographed as a pair without any failures. COPYRIGHT: (C)2003,JPO