| 摘要 |
PROBLEM TO BE SOLVED: To suppress swelling between a metalized wiring layer and a ceramic insulating board, with no degraded plating property while deflection of the substrate is reduced. SOLUTION: At least on the surface of a ceramic insulating board 1 acquired by baking a ceramic composition comprising glass and ceramic filler, a metalized wiring layer 3 which is baked simultaneously with the insulating board 1 and contains inorganic components in Cu particle and in the grain boundary of the Cu particle is coated. A coating layer comprising MgO by at least 1 mass % relative to Cu particle is formed on the surface of Cu particle in the metalized wiring layer 3, with the content of Mg in the ceramic insulating board 1 being 2 mass % or less in terms of an oxide. COPYRIGHT: (C)2003,JPO |
