发明名称 CONDUCTIVE PASTE, MANUFACTURING METHOD OF LAMINATED CERAMIC ELECTRONIC COMPONENT, AND LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To prevent ceramic powder from adversely affecting an electrical characteristic of a ceramic layer while containing the ceramic powder in a conductive paste for an inside conductor film in order to prevent a defect such as a crack due to difference of constriction behavior between the ceramic layer and the inside conductor film from easily occurring in baking, in a laminated ceramic capacitor. SOLUTION: In this conductive paste, the ceramic powder is contained in addition to conductive metal powder and an organic vehicle. The ceramic powder is ABO<SB>3</SB>-based calcined powder (A is Ba or the like and B is Ti or the like) containing at least one kind of compound of Ra (La or the like), Mg and Mn, has an average particle diameter smaller than that of the metal powder, and is not sintered at the sintering temperature of ceramics for the substrate constituting the ceramic layer. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003178623(A) 申请公布日期 2003.06.27
申请号 JP20020236240 申请日期 2002.08.14
申请人 MURATA MFG CO LTD 发明人 NAKAMURA TOMOYUKI;SHIMIZU MOTOHIRO;SANO HARUNOBU
分类号 H01G4/12;C04B35/468;C04B35/49;H01B1/22;H01G4/008;H01G4/30;(IPC1-7):H01B1/22 主分类号 H01G4/12
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