| 摘要 |
PROBLEM TO BE SOLVED: To improve the throughput of a substrate treating apparatus and, in addition, to prevent occupancy of treatment chambers. SOLUTION: A substrate W is transferred between a plasma ashing chamber and first to third liquid-phase treatment chambers in prescribed order by means of a processor robot. In each treatment chamber, a chemical is supplied to a chemical spray nozzle 122 and is further supplied to the surface of the substrate W from the nozzle 122, after the chemical is ultrasonically vibrated by means of an ultrasonic diaphragm 136. When the chemical is supplied to the substrate W, the substrate W is rotated while the substrate W is held by a spin chuck 120. Since the substrate W is transferred between the plasma ashing chamber and first to third liquid-phase treatment chambers in the prescribed order, the throughput of the substrate treating apparatus is not controlled by the rate-determining treatment. In addition, since the chemical is supplied to the substrate W in an ultrasonically vibrated state, the throughput speed of liquid-phase cleaning is improved. COPYRIGHT: (C)2003,JPO |
