发明名称 |
SUBSTRATE DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate structure capable of effectively compacting a device by increasing a current capacity and improving heat discharge efficiency. SOLUTION: A substrate device is provided with a substrate (71), a plurality of electronic components installed through an energizing plate on the substrate and a heat sink 53 for heat discharge abutted/arranged on the plurality of the electronic components. COPYRIGHT: (C)2003,JPO |
申请公布号 |
JP2003179324(A) |
申请公布日期 |
2003.06.27 |
申请号 |
JP20010378141 |
申请日期 |
2001.12.12 |
申请人 |
ASTOM CO LTD;HONDA MOTOR CO LTD |
发明人 |
TANIDA SHINICHI;INUI TSUTOMU;WAKITANI TSUTOMU |
分类号 |
E01H5/04;H01L23/36;H01L23/40;H05K1/18;H05K7/20;(IPC1-7):H05K1/18 |
主分类号 |
E01H5/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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