发明名称 SUBSTRATE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate structure capable of effectively compacting a device by increasing a current capacity and improving heat discharge efficiency. SOLUTION: A substrate device is provided with a substrate (71), a plurality of electronic components installed through an energizing plate on the substrate and a heat sink 53 for heat discharge abutted/arranged on the plurality of the electronic components. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003179324(A) 申请公布日期 2003.06.27
申请号 JP20010378141 申请日期 2001.12.12
申请人 ASTOM CO LTD;HONDA MOTOR CO LTD 发明人 TANIDA SHINICHI;INUI TSUTOMU;WAKITANI TSUTOMU
分类号 E01H5/04;H01L23/36;H01L23/40;H05K1/18;H05K7/20;(IPC1-7):H05K1/18 主分类号 E01H5/04
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