发明名称 ENCLOSURE FOR ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To solve the problem that a stress to a lid part is generated and that a screw is loosened when a shearing force due to the difference in a coefficient of linear expansion between a material for a baseplate and a material for the lid part is generated in the tightening part of the baseplate to the lid part. SOLUTION: The enclosure is provided with the baseplate 1 which comprises a plurality of tightening holes 4 in its circumference, the lid part 2 which comprises a recess used to form a space between itself and the baseplate 1, in which a lug part 3 coming into contact with the baseplate 1 is installed around an opening in the recess, in which through holes 5 are formed in the part of the lug part 3 so as to correspond to the plurality of tightening holes 4 in the baseplate 1 and in which linear-expansion-difference absorption parts 6 used to absorb a linear expansion difference due to heat by the baseplate 1 and the lid part 2 are formed near the through holes 5 and a plurality of tightening implement materials by which the lid part 2 and the through holes 5 corresponding to the tightening holes 4 are tightened and fixed to the baseplate 1. Even when an ambient temperature of an electronic apparatus is changed in a state that parts tightened by the tightening implement materials are subjected to a compressive load and even when the baseplate 1 and the lid part 2 are linearly expanded (or shrunk) due to the heat, the linear expansion difference due to the heat by the baseplate 1 and the lid part 2 is absorbed by the absorption parts 6. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003179365(A) 申请公布日期 2003.06.27
申请号 JP20010380110 申请日期 2001.12.13
申请人 NEC CORP 发明人 CHIBA KAZUHIRO
分类号 H05K7/12;H05K5/02;(IPC1-7):H05K5/02 主分类号 H05K7/12
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