发明名称 LIGAND-SUPPLYING APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a ligand-supplying apparatus and a ligand-supplying method for accurately and quantitatively supplying ligand onto a metal thin film. SOLUTION: The ligand-supplying apparatus comprises a supply means for supplying ligand onto the metal film, a control means for controlling the amount of ligand to be supplied by the supply means, and a light detection means for detecting the reflection light intensity of laser beams that are applied to the metal thin film. The control means stores and retains characteristics for indicating the relationship between the resonance angle of surface plasmon resonance that is generated in the metal thin film and the mass of the ligand, and controls the amount of supply of the ligand by detecting the intensity of reflection light when the laser beams are applied to the metal thin film at a resonance angle obtained from the characteristics corresponding to the target amount of coating of the ligand. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003177091(A) 申请公布日期 2003.06.27
申请号 JP20010377079 申请日期 2001.12.11
申请人 MITSUBISHI HEAVY IND LTD 发明人 TAWARA SATOSHI;NAKAYAMA HIROYUKI;SAKAI TAKUMA;INUZUKA HIROMASA;UCHIUMI ATSUSHI
分类号 G01N1/00;G01N21/27;(IPC1-7):G01N21/27 主分类号 G01N1/00
代理机构 代理人
主权项
地址