| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer polishing apparatus which can correct elongation of a protection sheet and can keep a polishing quality. <P>SOLUTION: In the wafer polishing apparatus, a retainer ring 28 is mounted to a holder 50 provided to a wafer holding head, a protective sheet 52 is extended into inside of the retainer ring, and polishing is carried out by pushing a wafer W against a polishing pad 20 via the protective sheet. The outer peripheral edge portion of the protective sheet 52 is held between the retainer ring 26 and the holder 50, and a means 78 for adjusting the tension of the protective sheet 52 is provided in the inner peripheral side of the held outer peripheral edge portion of the sheet. The tension of extended the sheet 53 can be made variable by the tension adjusting means 78. <P>COPYRIGHT: (C)2003,JPO |
